廠商登入區員工登入區學術研究機構登入區    
 

  
 

 

 

 
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

   

   
 
 
 

PDMS has Low stress, higher modulus, low-temperature thermal cure, high thermal stability, low shrinkage, good moisture resistance, good dielectric properties, negative tone patternable to an aspect ratio less than 1.3 with sloping sidewalls, demonstrated device integration, easily rework and low interfacial free energy such that molecules of most polymers won’t stick on or react with its surface. The interfacial free energy can be manipulated with plasma treatment.

PDMS is stable against humidity temperature.
PDMS is optically transparent and can be cured by UV light.
PDMS can attach on nonplanar surfaces.
PDMS is mechanically durable.
Disadvantages: Volume change and elastic deformation.
Recommended aspect ratio: 0.2-2

processes :
Spin coat
Soft bake
UV exposure
Post-exposure bake
Development
Hard bake
Ancillary products are available for edge bead removal, rinse, development and rework (stripping).

Description
:

Colorless, transparent solution of silicone-based material in mesitylene for spin-coating and photolithographic processing.

Potential Uses
:
Front and backside wafer protective layer; stress-buffer layer applications; redistribution layer; soldermask; negative photoresist; adhesive layer; sacrificial layer

spin-coating speed rpm

500

1000

1500

2000

3000

4000

5000

6000

8000

PDMS thickness μm
measurements

220

77

52

36

28

19

13

 

8

 

 

 

 

 

20

 

12

 


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Photodefinable polydimethylsiloxane (PDMS) for rapid lab-on-a-chip prototyping



If you don't find what you're looking for, Contact Us. We may have a suitable product that's not listed, or we may be able to develop a material to fit your specific needs. Tel : (02)2217-3442 / Fax : (02)2704-4070
 

 

 

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