Plasma is the most 
              environmentally safe method of both organic removal and surface 
              modification to date. Plasma processes can be tailored to produce 
              hydrophobic or hydrophilic surfaces on metals, plastics, glass or 
              polymers. Recent advances in the uses of polymers and as a result 
              the need for hydrophilic surfaces for adhesion has fueled the 
              development of the plasma surface modification industry. This 
              seminar will review the current industry and how it addresses the 
              adhesion issue in terms of available equipment and future 
              potential.
              
              
              
              

              What is Plasma
              
              Plasma can loosely be 
              defined as a partially or wholly ionized gas with a roughly equal 
              number of positively and negatively charged particles. It has been 
              dubbed as the “fourth state of matter" because of its general 
              properties which are similar to both a gas and a liquid.
              
              There are both high and 
              low temperature plasmas. High temperature plasma is found at 
              atmosphere in its manmade form as a plasma torch or naturally in 
              the form of lightning,.Low temperature plasmas, as used in surface 
              modification and organic cleaning, are ionized gases generated at 
              low pressures. These low pressures allow for a relatively long 
              free path of accelerated electrons and ions which are essentially 
              at ambient temperatures. With relatively few collisions there is a 
              low energy transfer thus keeping the temperature of the reaction 
              in the ambient range.
              
              The ionization of the 
              gas is accomplished by applying an energy field using one of three
              
              government regulated 
              source frequencies:
              
              Low frequency or < 100 KHZ.
              RF frequency or 13.56 MHZ.
              Microwave frequency or 2.45 GHZ.
              
              The frequencies selected 
              for these sources are controlled by international agreements to 
              prevent use of sources which would interfere with communication 
              bands worldwide. Unfortunately for manufacturers, the least 
              desirable method of generation is 
              also the least expensive - low 
              frequency. Low frequency plasmas are the least eflicient 
              for several 
              reasons which go beyond the scope of this presentation. The efficiency 
              is related to the energy necessary to sustain the ionization and 
              both the intensity and frequency of vacuum ultraviolet (VUV) 
              radiation.
              
              Most plasma system 
              use either RF frequency or MW frequency sources.
              XBH uses almost exclusively RF sources because of the overall 
              advantages associated with this 
              method. RF plasmas have been shown to exhibit significantly higher 
              levels of VUV which in part explains the higher concentrations of 
              electronically charged particles than found in the other plasma 
              sources. RF plasmas have also been noted to be more homogeneous 
              which is critical in treating irregularly shaped and overly large 
              objects.
              
              MW source plasmas are 
              generated “downstream” or in a secondary environment. This means 
              that the plasma is generated in one chamber and the active species 
              are drawn by vacuum differential into the work area. Though this 
              can be advantageous for organic removal it does produce a less 
              homogeneous process and as a result provides reduced uniformity 
              across the work area. In areas of surface modification the 
              effective depth of the modification is tens of nanometers so the 
              uniformity of the process becomes increasingly important.
              
              There are several 
              resultant effects to the plasma interaction with the surface, each 
              of which has a reaction to the adhesion process. These effects 
              are, but are not restricted to:
              
              Organic removal 
              CASING (Crosslinking via Activated Species of Inert Gases)
              Ablation
              Surface chemical restructuring