HM-ACF是一種具有可靠黏结性的
異方性導電的特殊膠膜，含各種類型ACF，適用于TAB，COG，COB，COF，等离子液晶顯示等各種壓接。
優點 :
降低翹曲量 ,
楊氏係數、熱膨脹係數較高
Unique
highly thermally conductive carbon fibers (1900 W/m°K) are used to create
a Z-axis bulk thermal conductivity of 750 W/m°K (at 40% fiber
volume)...twice the thermal conductivity of pure copper.
HM-ACF
Thermally Conductive Adhesive Film is currently being evaluated for a
variety of applications, including microprocessor die attach, Thermal
Interface Material, LED assembly, heat pipe attachment, heat sink
attachment and fluid cooling system assembly.
8µ diameter pure nickel fibers
4µ diameter process capability
Instant
“cure” hot melt thermoplastic
125°C to 200°C bonding temperature options
90°C to 160°C continuous operating capability
Medium
pitch density 100 series
uncoated pure nickel fibers
continuous process, <30% cost of high pitch version
High pitch density 200 series
heat treat Ni fibers in oxygen/argon to grow ¼ µ thick green nickel oxide
coating (NiO)
>20 mega-ohm resistance on 30µ comb pattern
11µ pitch capability
