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CIF Sensors : 10萬畫素, 1/5”, 1/6” |
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VGA
Sensors : 30萬畫素,1/3”, 1/4” |
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SVGA
Sensors : 48萬畫素, 1/3” |
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SXGA
Sensors : 130萬畫素, 1/2”,
1/3” |
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VXGA
Sensors : 200萬畫素, 1/2”,
1/3” |
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XVGA Sensor
Module : 30萬畫素, 1/4”, 5lux, 含Lens 及FPC |
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Backend
chips : Integrated Audio A/D, USB1.1 transceiver |
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Analog
sensor with NTSC/PAL format : 30萬畫素,1/3”,
1/4” |
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DLC
develops smallest camera module with area reduced by 1/3, to 6mm! (compared
to conventional 10mm)
Camera Module
Overview
The market for cellular telephones that incorporate cameras is growing
annually.
The themes of the camera module are small size, light weight and
compactness. It uses a 1/6-inch VGA CMOS sensor and short focus lens to
achieve reduced size of 6mm x 6mm x 4.5mm, and supports 330,000 pixels.
Features
Low profile module, at 4.5mm high
Supports side contact connectors
Supports different types of flexible printed circuit boards
Easy barrel replacement allows selection of required lens
Connectors are available from David Lu Group.
Main Specifications
|
Sensor process |
CMOS |
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Image size |
1/6 inch VGA |
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No. of pixels recorded |
660(H) x 492(V) pixel (approx. 330,000
pixels) |
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Power supply voltage |
2.8±0.2V & 1.5±0.15V |
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External dimensions |
6mm x 6mm x 4.5mm (camera body) |
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Recently released
XBH and Micron VGA
sensors versus the
Omnivision OV7648/9* |
|
Item |
XBH Camera module |
Micron MT9V011/MT9V111 |
Omnivision OV7648/9
SoC |
|
Launch |
Announced January
2004, samples in
March, mass
production in May |
February 2004
(already in mass
production) |
Mass production in
March/April 2003 |
|
Optical lens size |
1/6-inch |
1/4-inch |
1/4-inch |
|
Resolution |
VGA |
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Pixel pitch |
3.75μm (square) |
5.6μm (square) |
5.6μm (square) |
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Frame rate (max at
full resolution,
frames per second) |
30 |
|
Power supply |
2.8±0.2V or
1.5±0.15V
(sensor/photo diode
and I/O) and
1.5±0.1V (logic) |
2.8V (2.55V-3.05V) |
2.5V±10% (core),
2.5V±4% (analog),
2.25V-3.3V (I/O). |
|
Power consumption |
40mW at 30fps |
MT9V011: 60mW at
30fps,
MT9V111 SoC: 80mW at
30fps. |
40mW at 30fps
(including I/O
power) |
|
Size |
Module: 6mm square,
4.5mm depth (without
socket) |
N/A |
Chip: 4.93mm square,
4.76mm high |
DLC’s tiny new VGA
camera module and socket
next to a metric ruler
(cm). Courtesy of DLC
The new sensor’s 330,000 pixels are arranged in a 492 by
660 array and each has been reduced from 5.4 microns to
3.75 microns by advances in DLC’s manufacturing process.
According to the company, the design optimization and
move to a 0.18-micron process from the original
0.35-micron has not only helped the form factor, it has
also reduced the power consumption. The Camera module
combines a single chip containing the sensor and a
digital signal processor (DSP) with a double lens. The
whole module measures just 6mm square with a depth of
4.5mm (without socket), a 72% reduction in volume
compared with DLC’s currently available
module.
At minimum scene illumination levels as low as three lux,
DLC is claiming to be able to match CCD performance with
its new chips. Incorporating a photodiode double the
size of DLC’s current devices, and with double the
sensitivity, the new chips offer much-improved
performance in low light conditions. DLC also claims success in cutting leakage
current, an advance that cuts the dark signal voltage to
one-third that of present CMOS image sensors. In
addition, an optimized analog-digital converter and
pixel design also produce less noise and contribute to
better image quality.
產品特色在於耗電量極低、影像品質接近CCD、封裝的精密度高，一般CMOS
Sensor耗電量約為3.3V，DLC的產品耗電量則為2.8V。
XBH的新感測器內建了一個光電二極體，並藉由減少光電二極體所產生的暗電流，支援在較暗燈光下的正常攝影功能；在加入這個光電二極體後，新的CMOS
Sensor體積仍與現有產品相同，並沒有增加。另外，新元件的雜訊輸出電壓也較現有的CMOS
Sensor減少了三分之一。
If you don't find what you're looking for,
Contact Us.
We may have a suitable product that's not listed, or we may be
able to develop a material to fit your specific needs.
Tel : (02)2217-3442 / Fax : (02)2704-4070
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