To enhance mechanical
and chemical stability of resist pattern, it is recommended to employ
Silylation produces following changes in properties of silylated polymers:
increase of density
slight volume expansion
enhancement of thermal resistance
resistance to attack by common solvents
resistance to attack by oxygen plasma due to formation of surface layer of
Vapor silylation is as effective as silylation by dipping in silylating
solution and applicable at the same time polymer curing is performed.
By forming a layer of photoresist on the substrate, and exposing and
developing the photoresist from the portions of the layer of photoresist
remaining after the development. After development of the layer of
photoresist, the substrate is treated with a silylation compound capable of
cross-linking the photoresist and of promoting adhesion of the photoresist
to the substrate.
A preferred silylation compound is
To apply silylation on photoresist is easy , just like HMDS applied on
substract for adhesion promoting.
Process for silylation for water proof coating
Substrate was vapor treated with
at 145°C. and 1 Torr for 2
minutes. Following this silylation pre-treatment, the wafer was allowed to
stand for one minute to cool,The pretreatment is purpose for bonding
improvement with AU ( maybe need, maybe not need)Then 2 ml of
NR7-1000P)photoresist was spin coated on to the wafer-condition per
Soft baked -condition per instruction
Development -condition per instruction
Rinsing for 30 seconds in deionized water and air drying
The wafer was then vapor treated with
at 145°C. and 1 Torr for
2 minutes to stabilize the elements.
Top Surface Imaging
Through Vapor Phase Silylation
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